In 5G base station operations, thermal management modules serve as the core components ensuring equipment stability. Devices such as RRUs (Remote Radio Units) and power modules within base stations operate under sustained high loads, generating significant heat. These thermal modules must achieve precise temperature control within confined spaces while preventing heat from affecting surrounding sensitive components. Ceramic fiber paper, with its lightweight, high-temperature resistance, strong insulation, and excellent flexibility, has pioneered multiple innovative applications in 5G base station thermal management modules, offering new solutions for efficient heat dissipation.
Ceramic fiber paper plays a pivotal role in the “thermal partitioning” design of cooling modules. The internal structure of 5G base station cooling modules is highly compact, with power components (such as power amplifier chips) often positioned less than 5cm from signal processing chips. The former can reach operating temperatures of 80°C-120°C, while the latter must remain below 60°C to prevent signal interference. In such scenarios, high-density ceramic fiber paper (0.5mm-1mm thick, density ≥280kg/m³) can be employed to create a “flexible thermal barrier” between the two chip types— — With a room-temperature thermal conductivity of just 0.035 W/(m·K), ceramic fiber paper effectively blocks heat transfer from power devices to signal chips. Field tests show that installing ceramic fiber paper reduces temperatures around signal chips by 8°C–12°C, fully meeting operational temperature requirements. Moreover, ceramic fiber paper can be cut to irregular shapes based on the module’s internal structure, conforming to complex component surfaces. This avoids the challenges of traditional rigid insulation materials in adapting to compact spaces.
Ceramic fiber paper excels in the dual role of “insulation protection + auxiliary heat dissipation” within thermal management modules. 5G base station cooling modules often employ liquid or air cooling, where cooling fluid pipes, fan motors, and circuit boards operate in close proximity, demanding both thermal insulation and electrical isolation. Selecting zirconia-based ceramic fiber paper (temperature resistance ≥1200°C, breakdown voltage ≥15kV/mm) wrapped around the exterior of coolant pipes reduces heat loss from the pipes through the material’s low thermal conductivity (boosting liquid cooling efficiency by 10%-15%). Simultaneously, its superior insulation prevents electrical leakage risks between pipes and circuit boards. Furthermore, inserting ultra-thin ceramic fiber paper (0.2mm thick) between the stator and rotor of cooling fan motors blocks heat transfer to the fan housing without affecting motor rotation. This prevents high housing temperatures from impacting surrounding components. The flexible nature of ceramic fiber paper also avoids increasing motor operating resistance, ensuring stable cooling fan performance.

Within the “vibration damping + long-term durability” requirements of cooling modules, ceramic fiber paper demonstrates unique advantages. 5G base stations are often deployed outdoors, where typhoons and vehicle vibrations can cause internal components to loosen. Ceramic fiber paper possesses excellent elastic recovery (≥80%). can be cut into shim-shaped pads placed between heat sink fins and the substrate. This design absorbs vibration energy through its fiber structure, preventing heat dissipation failure caused by fin displacement due to vibration. It also fills microscopic gaps between fins and the substrate, reducing thermal resistance. Field testing shows that heat dissipation modules equipped with ceramic fiber paper shims exhibit only a 3% efficiency decline after 1,000 simulated vibration cycles (50Hz frequency, 0.5mm amplitude), significantly lower than the 12% efficiency drop observed without shims. Moreover, ceramic fiber paper exhibits outstanding aging resistance. After three years of operation in outdoor temperature-humidity cycles ranging from -30°C to 60°C, it retains over 90% of its thermal insulation and electrical insulation properties, eliminating the need for frequent replacements and reducing base station maintenance costs.
Overall, ceramic fiber paper perfectly meets the complex demands of 5G base station heat dissipation modules through its flexible adaptability, integrated thermal insulation and electrical insulation, and weather resistance. Its innovative application not only enhances the temperature control precision and operational stability of heat dissipation modules but also provides material support for the miniaturization and high integration of base stations, establishing it as a key auxiliary material in the thermal management field of 5G communication equipment.